Singapore Role overview
About this role
As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
LOCATION: Singapore
CRITERIA: Current students studying in Universities which are based in Singapore
INTERNSHIP DURATION: Minimum 20 weeks full time commitment with the option of extending up to a further 12 weeks.
Intern- Mechanical and Thermal Analysis of Advanced Packaged Devices
WHAT YOU CAN EXPECT TO LEARN:
- Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.
- Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.
- Exposure to cross-functional collaboration in a high-tech R&D environment.
- Insights into the challenges and innovations in advanced packaging technologies.
- Professional development through technical presentations and documentation.
PROJECT OVERVIEW:
This internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions. The project supports the growth of the Advanced Packaging Lab in Singapore and aims to enhance understanding of package reliability and performance.
KEY RESPONSIBILITIES:
- Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.
- Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.
- Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.
- Present findings to internal stakeholders and participate in technical discussions.
- Continuously refine experimental procedures and maintain clear documentation.
WHO ARE WE LOOKING FOR:
A self-driven individual that is resourceful, passionate about running experiments and
analysing data. Able to work independently, has a good work attitude and willing to learn.
Should have good communication and presentation skills.
RELEVANT SKILLSETS:
- Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).
- Familiarity with thermal and mechanical characterization techniques is a plus.
- Excellent communication and presentation skills.
- Ability to work independently and in a team-oriented environment.
ACADEMIC CREDENTIALS:
- Electrical Engineering, Materials Science, or Materials Engineering preferred.
#LI-SP
Qualifications
Responsibilities
As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
LOCATION: Singapore
CRITERIA: Current students studying in Universities which are based in Singapore
INTERNSHIP DURATION: Minimum 20 weeks full time commitment with the option of extending up to a further 12 weeks.
Intern- Mechanical and Thermal Analysis of Advanced Packaged Devices
WHAT YOU CAN EXPECT TO LEARN:
- Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.
- Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.
- Exposure to cross-functional collaboration in a high-tech R&D environment.
- Insights into the challenges and innovations in advanced packaging technologies.
- Professional development through technical presentations and documentation.
PROJECT OVERVIEW:
This internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions. The project supports the growth of the Advanced Packaging Lab in Singapore and aims to enhance understanding of package reliability and performance.
KEY RESPONSIBILITIES:
- Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.
- Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.
- Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.
- Present findings to internal stakeholders and participate in technical discussions.
- Continuously refine experimental procedures and maintain clear documentation.
WHO ARE WE LOOKING FOR:
A self-driven individual that is resourceful, passionate about running experiments and
analysing data. Able to work independently, has a good work attitude and willing to learn.
Should have good communication and presentation skills.
RELEVANT SKILLSETS:
- Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).
- Familiarity with thermal and mechanical characterization techniques is a plus.
- Excellent communication and presentation skills.
- Ability to work independently and in a team-oriented environment.
ACADEMIC CREDENTIALS:
- Electrical Engineering, Materials Science, or Materials Engineering preferred.
#LI-SP