Quantum Materials R&D Engineer

IBM Quantum is seeking a Quantum Materials R&D Engineer to join the Quantum Hardware team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. In this role, you will contribute to the development, characterization, and optimization of advanced materials and processes, including superconducting thin films, interconnects, and solder systems, that support next-generation quantum computing technologies. This position is ideal for a highly collaborative, hands-on engineer or scientist who enjoys addressing complex materials challenges in a laboratory setting. Prior quantum computing experience is not required. Candidates with strong backgrounds in materials science, materials characterization, thin-film technologies, metallization, interconnects, or related fields are encouraged to apply. This is a fully on-site position based in Yorktown Heights, NY. As a Quantum Materials R&D Engineer, you will leverage your expertise in materials deposition, fabrication, characterization, and failure analysis while working closely with scientists and engineers across the quantum hardware organization. This hands-on role involves extensive laboratory work utilizing advanced fabrication and metrology tools to develop, process, and evaluate materials and devices. Advanced Materials Development & Optimization Develop and optimize advanced packaging interconnects, metal thin films, and solder systems to improve device yield, reliability, and performance. Investigate and mitigate materials-related loss mechanisms through the study of interfacial scattering, grain boundaries, defects, and chemical inhomogeneities. Design and execute experiments using purpose-built test vehicles to evaluate materials behavior and performance. Partner with design and process engineering teams to ensure seamless integration of new materials into advanced packaging solutions. Metrology & Characterization Prepare and analyze samples using best practices and advanced characterization techniques. Perform detailed electrical, structural, and chemical analyses to understand material and interface properties. Apply statistical and analytical methods to extract meaningful insights from complex experimental datasets. Design and execute characterization plans using tools such as XPS, SIMS, FIB/TEM cross-sections, XRD, and XRF to identify root causes and drive process improvements. Cross-Functional Collaboration Identify technical risks, guide material selection decisions, and support integration of new materials into fabrication processes and device architectures. Contribute technical leadership within multidisciplinary project teams and mentor junior engineers as needed. Documentation & Communication Maintain comprehensive records of experimental procedures, process development activities, and test results. Present technical findings, recommendations, and project updates to internal stakeholders and leadership. Ph.D. in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, or a related field; OR M.S. in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, or a related field with 3+ years of relevant industry experience; OR B.S. in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, or a related field with 5+ years of relevant industry experience. Minimum 5 years of experience in the characterization and development of superconductors, metallic thin films, and/or solder systems. Demonstrated expertise in materials characterization and data-driven problem solving. Strong laboratory experience and ability to independently design and execute experiments. Experience depositing, characterizing, and performing electrical measurements on superconducting materials. Hands-on experience with one or more advanced characterization techniques, including XPS, SIMS, FIB, and TEM. Familiarity with semiconductor fabrication processes, cleanroom environments, and associated process tools