Yorktown Heights, United States Role overview
About this role
At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. In this role you will undertake studies of advanced bonding and reflow techniques with potential applications to high performance computing. This role will include significant efforts towards understanding the effects between different package constructions and bonding reflow techniques, providing exposure to relevant packaging analysis methods. Candidate for this role is required to have the following expertise: Studies in Physics, Microelectronics/EE, or a related discipline Proficient in SMT soldering processes Collaborate within a team on the same project Analytical skills to assess results of solder joints after solder process. Openess to learn new skills and explore innovative ideas. Candidate for this role would also benefits from the following expertise: Advanced studies Microelectronics/EE or physics Deep knowledge of SMT assembly processes in respect to soldering Solder joint evaluation knowledge to assess quality of the joint and Knowledge how to improve solder connection based of different solder alloys and pure composition solders. Summarize analytical results and draw comprehensive conclusions.