FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months)

About Qualcomm 

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress. 

Join Us in Shaping the Future 

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology. 

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our 2027 intern class in Toronto, Canada! 

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Role Overview 

Our group is focused on creating next-generation SerDes IP for Qualcomm’s expanding roadmap. We deliver industry-leading high-speed interconnect solutions targeting High-Performance Computing and Artificial Intelligence applications. We are looking for enthusiastic Digital Design Engineering Intern(s) to join our fun and dynamic team of talented innovators.

Why You’ll Love Interning with Our Team

We invest in our interns in hopes to hire for our future team. Your experience here includes:

• Impact: You will work on real projects that are critical to our product roadmap.

• Mentorship: You will be paired with an engineer dedicated to your growth and success.

• Learning: You will gain hands-on experience with industry-standard tools and methodologies.

• Career Growth: Successful interns will be first in line for full-time offers upon graduation.

• Team Culture: Have fun, try new things, and build connections through team events and group activities.

Responsibilities may include:

• Learn High-Speed Interconnect fundamentals and principles of SerDes Design

• Own the end-to-end design of new features and/or optimizations

• Implement modules in hardware design languages such as System Verilog

• Assess design requirements/specifications and devise implementation plans

• Analyze test failures to uncover design bugs

• Improve design workflows for efficiency and scalability

• Ensure design quality with industry methodology and tools

• Employ AI-enabled tools and infrastructure to accelerate development

• Take on opportunities to lead, plan, and coordinate tasks with team members

• Cross-functional collaboration with other teams including design verification, front-end integration, systems, analog, firmware/software, physical design, and project management

Preferred Qualifications:

• Enrolled in a Computer or Electrical Engineering university program

• Experience with Digital logic / Digital design

• Relevant academic or personal project experience

• Knowledge of Verilog/System Verilog, Python, Perl, C/C++, Linux/Unix environment

• Working knowledge of scripting in the Linux/Unix environment

• Knowledge of ASIC design and simulation tool sets (synthesis, simulator)

• Some basic understanding of the ASIC design flow

• Strong problem solving and analytical skills

• Strong communication and organizational skills

• Strong initiative and independently capable of driving tasks to completion

Education Requirements:

• In study towards a bachelor’s degree in one of the following: Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or related field

• For 16-month internships: must be available May/June 2027 - August/September 2028

• Expected graduation date of November 2028 or later.

• 1+ years of academic experience with programming languages such as C, C++, Python, etc

Qualcomm’s Internship Program 

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive housing stipend to accommodate for the duration of your internship. 

Application Process 

We will review resumes on an ongoing basis, and a recruiter may reach out to you. Advancing candidates may be invited to complete a timed HackerRank challenge to evaluate their technical skill set. 

Export Control Notice 

This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.